FAILURE ANALYSIS – LEVEL 1

REAL-TIME X-RAY

Real-time X-ray inspection is a powerful non-destructive technique widely used in semiconductor failure analysis to evaluate the internal structure of a package without the need for mechanical cross-sectioning. By capturing high-resolution images of hidden features, X-ray helps engineers detect and localize defects that are otherwise invisible to the naked eye.

KEY APPLICATIONS INCLUDE:

• Solder Joint Integrity: Identifying cold solder joints, voids, cracks, bridging, or insufficient wetting that could compromise mechanical stability and electrical connectivity.
• Wire Bond Inspection: Detecting lifted bonds, broken wires, misaligned bonds, or bond loop irregularities that may lead to open circuits or intermittent failures.
• Die Attach Quality: Revealing voids, delamination, or uneven coverage in the die attach material, which can affect thermal performance and long-term reliability.
• Package Cracks and Voids: Locating internal cracks, air gaps, or foreign material entrapment that may accelerate failure under thermal or mechanical stress.
• Ball Grid Array (BGA) and Flip-Chip Analysis: Inspecting solder balls for bridging, head-in-pillow defects, non-wet opens, or missing/shifted bumps.
• Encapsulation Issues: Checking for uniformity in mold compound, identifying trapped voids, or resin bleed that could impact device integrity.

Because the imaging is done in real time, engineers can dynamically adjust viewing angles, magnification, and contrast to zero in on specific areas of concern. This enables rapid root cause identification, process validation, and quality assurance. Real-time X-ray is particularly valuable as an early screening tool, allowing organizations to prevent latent defects from progressing into more costly stages of assembly, testing, or field operation.