ICE has a complete chemical lab for the purpose of locating defects at any particular layer or component in the failing device, services include chemical deprocessing and ic laser decapsulation.
In addition, ICE has various sample preparation staining recipes to clearly distinguish structural details (Delineate) for optical and SEM inspection and analysis.
SEM Image taken of defect at the Bulk Si layer. Top metal and Poly removed (post wet chemical etch).
Examples of cross sectioned chemical etch delineation.
Laser Decapsulation
No destruction of wires during opening Au,Cu, CuPd, Ag wires exposed Works with high temp and hard cured EMC Complex shape cavities for stacked die 1st and 2nd bond exposure Ceramic and destructive delid applications Cutting IC’s
The BL2500 is a tabletop laser tool designed especially for laser decapsulation of your packaged devices. Our engineers have implemented software and hardware features tailored to your application. The tool boasts compact size and the solid German-American construction. Where automated stages are not needed the BL2500 is your tool of choice.
Our BL2500 is equipped with the same quality American and European made fiber laser technology that you will find in our fully automated BL5500 for IC decapsulation. This laser tool is equipped with a high-resolution Ethernet camera with 5 or 10Mp for laser alignment functions and a live view camera for process monitoring. The integrated red laser pointer is used for comfortable preview and camera free adjustment and positioning of the workpiece.
For ease of sample handling a special stage is provided for the application. Ultimate safety is provided with our full view window and automated door. Many custom configurations are available to suit your specific decapping needs.