FAILURE ANALYSIS LEVEL 2

DECAPSULATION

JetEtch™ Pro by Nisene

The Nisene JetEtch™ decapsulation takes an integrated circuit encapsulated in mold compound and removes it using a user-specified chemical solution. The process of mold compound removal is called “decapsulation” and is often referred to as “decapping,” “Jet-Etching,” and similar.  

• The decapsulation can be performed on copper or aluminum wire bonds.
• This process is commonly used for semiconductor failure analysis and counterfeit protection.
• Manual decapsulation can also be performed to etch open IC’s and other packages for internal visual inspection.