FAILURE ANALYSIS LEVEL 2

MICROMANIPULATOR PROBING STATION

Often, a customer needs to microprobe a specific pad or structure on a semiconductor die to validate performance, investigate issues, or extract detailed electrical characteristics. This process is performed under a high-powered optical microscope or, in some advanced cases, with the assistance of scanning electron microscopes (SEM) for submicron resolution.

This method is critical for tasks such as:

• Device characterization
• Failure analysis and root cause investigation
• Parametric testing before packaging
• Debugging prototype circuits
• Verifying design against expected performance