FAILURE ANALYSIS LEVEL 1

NON-DESTRUCTIVE PHYSICAL ANALYSIS

Non-destructive physical analysis (NDPA) plays a critical role in semiconductor evaluation because it allows engineers to inspect and characterize devices without damaging or altering them. This is especially important when working with limited sample sizes, high-value components, or customer returns where preserving the integrity of the device is essential.

Analysis needed to discover the root cause of the failure using the following tests:

• External Visual
• Curve Trace
• X-Ray
• CSAM
• FA Report