Board Level Reliability Testing (BLRT) Mechanical Shock to support a wide array of multiple standards.
JESD22-B104C Mechanical Shock & JESD22-B110B Mechanical Shock
Component and Sub-assembly–both supporting JESD22-B111 Board Level Drop Test Method of Components for Handheld Electronic Products.
MIL-STD-883K
Mechanical Shock Test Conditions A-E (E = 10,000G @ .20 msec).Additionally, input and ideal half-sine sinusoidal shock pulses can be delivered to your device, as well as, tests can be designed to “Control-a-Response” mimicking real-world transient shock capture, but carried out in a repeatable laboratory environment.
Board Level Reliability Testing (BLRT) Vibration to support a wide array of multiple standards.
These include, but are not limited to JESD22-B103B Vibration-Variable Frequency (Displacement and Swept Sine Service Conditions 3-8 and Random Vibration Service Conditions D-I) Sine Resonance Search Followed by Dwell can also be performed.