Real-time x-ray is used in Failure Analysis to find cracks, open solder joints, voids, wire bonding issues and many other anomalies
2D image with eHDR of a Micro chip on board
2D image with eHDR of a Water Micro Bump
In addition, x-ray is used to find solder ball/bump voids and shorts as well as other solder joint abnormalities. An x-ray can find broken Copper traces in semiconductor packages & PCBs.