FAILURE ANALYSIS LEVEL 2

DESTRUCTIVE PHYSICAL ANALYSIS

Destructive Physical Analysis (DPA) is a critical technique in semiconductor reliability testing and failure analysis. Unlike non-destructive methods, DPA involves physically opening, dissecting, or altering a device to directly examine its internal materials, structures, and construction. Because the process damages or destroys the part, DPA is typically performed after non-destructive evaluations have been completed, or when a deeper level of insight is required.

In-depth analysis needed to discover the root cause of the failure using the following tests:

• Decapsulation
• Internal Visual Inspection (usually followed by decapsulation)
• Probing
• Liquid Crystal Analysis
• Emissions Microscopy
• Thermal Emissions

Destructive Physical Analysis is often considered the “last line of investigation” in semiconductor evaluation. While it sacrifices the device, it delivers the most comprehensive and conclusive insights into internal construction, workmanship, and material integrity—making it indispensable for reliability assurance, failure analysis, and counterfeit detection.