FAILURE ANALYSIS – LEVEL 3

MULTI-PURPOSE BOND STRENGTH TESTING

Multi-purpose bond strength testing in semiconductors is used to evaluate the mechanical integrity of the bonds that connect different parts of a device—such as wire bonds, die attach, and solder joints. These tests ensure the reliability, durability, and performance of semiconductor components under real-world conditions.

Dage Series 4000 Multipurpose Bond Tester:
The Dage 4000 bond tester is multi-purpose, capable of performing all pull and shear applications. The 4000-bond tester is configured to perform wire bond pull and solder ball shear test.