FAILURE ANALYSIS SERVICES

Failure analysis is not just about fixing what broke—it’s about building better, more reliable semiconductors.

Failure analysis is a vital component of semiconductor testing because it helps uncover the root causes of device or process failures—ensuring product quality, reliability, and performance. In such a high-precision industry, even a microscopic defect can lead to massive downstream costs, field failures, or safety concerns. Failure analysis is how those problems are understood and prevented.

We work with many different customers who manufacture devices which span the entire spectrum of semiconductor technology.

OUR SERVICES INCLUDE:

FAILURE ANALYSIS – LEVEL 1

• Realtime X-Ray Services
• External Visual Inspection
• CSAM Scanning
• Curve Tracing

FAILURE ANALYSIS – LEVEL 2

• Chemical Decompressing
• Decapsulation
• Quantum Focus Instruments
• Micromanipulator Probing

FAILURE ANALYSIS – LEVEL 3

• Multi-Purpose Bond Strength Testing
• Dye/Pry Test
• SEM/EDX Test
• Cross Sectioning/Optical Microscopy