Innovative Circuits Engineering’s Failure Analysis group performs root cause analysis on a wide variety of integrated circuit devices.
We work with many different customers who manufacture devices which span the entire spectrum of semiconductor technology.
Level 1: External Visual Inspection
![Failure Analysis Testing, Curve Trace, C-SAM, Root Cause of Failure](https://b2699332.smushcdn.com/2699332/wp-content/uploads/External-Visual-Insepection-3.jpg?lossy=1&strip=1&webp=1)
External visual inspection illustrating damaged resistors on a PCB.External visual inspection illustrating damaged resistors on a PCB.
![Failure Analysis Testing, Curve Trace, C-SAM, Root Cause of Failure](https://b2699332.smushcdn.com/2699332/wp-content/uploads/External-Visual-Insepection-1.jpg?lossy=1&strip=1&webp=1)
Post reliability stress testing showing solder coarsening and solder stress cracking.
![Failure Analysis Testing, Curve Trace, C-SAM, Root Cause of Failure](https://b2699332.smushcdn.com/2699332/wp-content/uploads/External-Visual-Insepection-4.jpg?lossy=1&strip=1&webp=1)
External visual inspection illustrating delamination between molding cap and substrate on a semiconductor package.
Level 2: Internal Visual Inspection
![semiconductor failure analysis services, Failure Analysis Testing, Curve Trace, C-SAM, Root Cause of Failure](https://b2699332.smushcdn.com/2699332/wp-content/uploads/internal-inpseciton.jpg?lossy=1&strip=1&webp=1)
High compound microscope lenses
![semiconductor failure analysis services, Failure Analysis Testing, Curve Trace, C-SAM, Root Cause of Failure](https://b2699332.smushcdn.com/2699332/wp-content/uploads/internal-inpseciton2.jpg?lossy=1&strip=1&webp=1)
Internal visual optical inspection photos of a die following decapsulation.
![semiconductor failure analysis services, Failure Analysis Testing, Curve Trace, C-SAM, Root Cause of Failure](https://b2699332.smushcdn.com/2699332/wp-content/uploads/internal-inpseciton3.jpg?lossy=1&strip=1&webp=1)
Liquid crystal analysis is useful in detecting and characterizing thermal flow on semiconductor surfaces.
Level 3 Failure Analysis Services
![semiconductor failure analysis services, Failure Analysis Testing, Curve Trace, C-SAM, Root Cause of Failure](https://b2699332.smushcdn.com/2699332/wp-content/uploads/FA3-3-1.jpg?lossy=1&strip=1&webp=1)
Multi-purpose Bond Strength Testing
![semiconductor failure analysis services, Failure Analysis Testing, Curve Trace, C-SAM, Root Cause of Failure](https://b2699332.smushcdn.com/2699332/wp-content/uploads/FA3-2-2.jpg?lossy=1&strip=1&webp=1)
SEM / EDX Capability
![semiconductor failure analysis services, Failure Analysis Testing, Curve Trace, C-SAM, Root Cause of Failure](https://b2699332.smushcdn.com/2699332/wp-content/uploads/FA3-1.jpg?lossy=1&strip=1&webp=1)
Dye Penetrant (Dye/Pry) Test