Thermal Shock
The objective of this test is to determine the ability of the package to withstand sudden and rapid changes of temperature within liquid environment. The test is designed to accelerate the effects of thermal mismatch amongst the die/ assembly components. Special systems with two inert fluorocarbon baths are used that are capable of generating hot and cold air as per the test requirements. The test is intended to identify failures due to die cracking, package cracking, bond wire defects and any interconnect related failures. All of the parts stressed during the test must pass pre and post electrical tests to have successfully completed the test.
Thermal Shock Systems
Our liquid-to-liquid Thermal Shock System provides complete flexibility in various temperature ranges.
- Variable temperature ranges
- Easy programming features
- Equipped with all the safety features
- Cycle counters
- Adjustable soak and dwell times
- Fully calibrated
