ICE provides microscopic analysis that include cross sectioning, SEM and optical microscopy.
Allied Multiprep System
SEM Image: Cross Section View of defect on a solder bump.
Optical Image: Parallel lapping image illustrating a defect within a die metal layer.
- Precise semi-automatic sample preparation of a wide range of materials for optical microscopy or SEM.
- Precision cross sectioning and parallel polishing in preparation for microscopic analysis (optical or SEM) of defects.
- Cross-sectioning is a failure analysis technique for mechanically exposing a plane of the area of interest in a die or package for further analysis or inspection.
- Parallel lapping is performed by lapping a silicon die down from the top, removing one metal layer at a time until the exact failure location is exposed.
- Backside die parallel polishing in preparation for backside emissions.