Level 2 Decapsulation: JetEtch™ Pro by Nisene
The Nisene JetEtch™ decapsulation takes an integrated circuit encapsulated in mold compound and removes it using a user-specified chemical solution. The process of mold compound removal is called “decapsulation” and is often referred to as “decapping,” “Jet-Etching,” and similar.
The decapsulation can be performed on copper or aluminum wire bonds.
This process is commonly used for semiconductor failure analysis and counterfeit protection.
Manual decapsulation can also be performed to etch open IC’s and other packages for internal visual inspection.