FAILURE ANALYSIS LEVEL 2

QUANTUM FOCUS INSTRUMENTS (QFI)

• Photoemission detects & localize gate leakage, dielectric breakdown, forward bias junction, oxide pinholes, and failures   which result in electron-hole recombination.
• XIVA™ LSIM locates shorts, junction defects, problem VIAs and other integrated circuit defects. XIVATM works by   scanning a laser beam through a microscope lens while monitoring the device I/V response.
• Thermal-Detection medium wave IR hot spot sensor locates ohmic faults from their self-heating.  Heat radiates in the   infrared spectral range and the Thermal sensors capture these radiant emissions.

Advantages of QFI in Failure Analysis:

• Non-Destructive: Devices remain intact while being analyzed, preserving them for further electrical or physical testing.
• High Resolution & Sensitivity: Enables defect localization at the die and interconnect level with sub-micron precision in some systems.
• Speed & Efficiency: Provides fast feedback for debugging, reducing time-to-root-cause compared to purely destructive methods.
• Versatility: Useful across a wide range of device types—ICs, discrete components, and advanced packages such as flip-chips and BGAs.