FAILURE ANALYSIS LEVEL 3

DYE PENETRANT – DYE AND PRY TEST

Dye penetrant (referred to as Dye and Pry Test) is a PCB FA analysis technique that involves submerging a failing circuit board in a brightly colored dye. The mix is then subjected to a vacuum to force the dye into any cracked or improperly formed solder interfaces. The sample is then pulled from the dye and allowed to dry.  The sample component is unceremoniously (but very delicately) pulled from the board, exposing the interconnect surfaces. The component-side & board-side of the sample surfaces are inspected for any traces of dye; finding dye on any surface where a connection is supposed to be made is indicative of voiding, cracks or porosity that is open and accessible to the atmosphere.  The extent of the dye may indicate open or compromised connections.

Optical image illustrating overall view of dye/pry solder joint test failures.

Optical image illustrating closeup of all dye/pry solder joint failure.